Jason Lin, PhD, is a skilled professional in semiconductor packaging and integration, currently serving as Section Manager at TSMC since November 2019, where leadership of a 15-member team focuses on advanced packaging for AI products and collaboration with top-tier customers to drive semiconductor innovation. Previously, as a Technical Manager at TSMC, Jason contributed to the development and successful mass production of the world's first 3DIC product using Hybrid Bonding technology. At Micron Technology, Jason led the 3DIC package integration project for High-Bandwidth Memory and managed cross-functional teams. Earlier experience includes a Senior Engineer role at Dyson focusing on energy storage technologies and academic research culminating in a PhD at Imperial College London, specializing in optoelectronics and wide-band-gap semiconductors.
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