Jason Wang

Jason Wang is an accomplished leader in the semiconductor industry with extensive experience in supply chain management, business process integration, and digital transformation. Currently serving as Director of the Advanced Packaging Supply Chain Solution Division at 台積電 since November 2020, Jason Wang is responsible for architecting enterprise applications to enhance TSMC’s logistics and planning capabilities across semiconductor products. Prior to this role, Jason Wang held various leadership positions including President of KYEC USA and Director of Planning and Logistics at Aptina Imaging, where accomplishments included managing significant revenue and optimizing inventory levels. With a strong educational background including degrees in Industrial Engineering and an Executive MBA, Jason Wang continues to advance business excellence and integration within global supply chains.