Jay Chiu is an experienced professional in the semiconductor industry, currently serving as a Section Manager at 台積電 since January 2021, specializing in InFO/CoWoS/NPI of Advanced Packaging, with responsibilities as a Process Integration and RDL Loop Owner. Previously, Jay Chiu held various positions at United Microelectronics Corporation (UMC) from December 2011 to January 2021, including Section Manager and Technical Manager, focusing on Process Integration at R&D. Jay Chiu holds a PhD in Materials Science and Engineering, an MS in Nanotechnology, and a BS in Materials Science and Engineering, all from National Chiao Tung University.
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