Joe (Tienchi) Ji is a Senior Path Finding RD Engineer at 台積電 with over five years of experience in semiconductor process development. They specialize in 3DIC advanced packaging, focusing on developing critical customer projects and pioneering novel hybrid bonding technology. Previously, Joe contributed to substantial improvements in EUV pellicle production and achieved a Taiwan Golden Quality Award for their innovative work. Joe holds a Master's degree in Material Science Engineering from 國立清華大學 and is actively exploring new opportunities.
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