Joe Yeh is currently a Program Manager at TSMC, where they oversee various aspects of program management. Previously, Joe worked as an Advanced Package Development Engineer at Analog Devices from 2019 to 2022, focusing on assembly process development and supply chain management. Joe also held roles at TSMC from 2009 to 2010 as an Integration Engineer, managing customer products in solder bumping processes, and at Amkor Technology as an Application Engineer from 2007 to 2009. Joe earned a Bachelor of Science degree in Material Science & Engineering from National Taiwan University in 2005.
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