Kris Chang is an experienced Technical Manager specializing in advanced packaging and MEMS technology. Currently serving as a Program Manager at 台灣積體電路製造股份有限公司, Kris has a robust background that includes roles at MediaTek, KLA, and Intel Corporation, where they managed significant projects in 3DIC development and advanced packaging technologies. Kris holds a PhD in Power Mechanical Engineering from National Tsing Hua University and has a strong track record in project management, process improvement, and technical collaboration. Their expertise encompasses areas such as mechanical simulation, product management, and cross-functional team leadership.
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