政融 (Kuo, Cheng-Jung) 郭 is currently a Principal Engineer specializing in Advanced Packaging 3DIC Metrology at TSMC. They previously served as a Senior Application Specialist at Nova Measuring Instruments, where they managed customer relations and provided technical support.政融 holds a Master's degree in Chemical Engineering from National Taiwan University, where they conducted research on Surface Plasmon Resonance bio-chips. Earlier in their career,政融 worked as an R&D Chemical Process Design Engineer and served as a Duty Sergeant during their mandatory military service.
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