Leon Shih is a Principal Engineer at 台灣積體電路製造股份有限公司, where they lead the GaN HEMT process integration team. With 15 years of experience in R&D and semiconductor fabrication, Leon previously served as a Senior Technology Development Engineer at TSMC SSL, focusing on device performance enhancement and reliability improvement. Their expertise includes patent contributions to LED technology and significant achievements in new device development and process optimization during their tenure at TSMC. Leon holds a Bachelor's and a Master's degree in Materials Science from National Cheng Kung University.
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