Lin Sun

Lin Sun is a Principal Device Engineer at TSMC, where they lead the operation of Logic SPICE model fitting and quality assurance. They have four years of project management experience in semiconductor SPICE models and two years in software development and project coordination. Previously, Lin held senior device engineer positions at TSMC and Hisilicon, focusing on SPICE model parameters extraction and supporting analog design. Lin possesses a solid understanding of the physics and compact models of various semiconductor devices and is proficient in process management from 0.25um to 28nm technology.