Nicol Lam is a Senior Equipment Engineer at TSMC, having started in February 2022, where responsibilities include pioneering the fab startup for 4nm chip manufacturing in the United States and supporting the ramp-up for advanced 5nm chip manufacturing in Tainan. Prior experience at TSMC includes on-site troubleshooting of Optical Critical Dimension and Overlay metrology equipment. Before TSMC, Nicol worked as an Engineering Trainee at Line8 Pte Ltd and as a Technology Innovation Centre Intern at SATS Ltd., focusing on 3D modeling and process simulation for Digital Twin projects. Earlier experience includes serving as a Training & Operation Specialist in the Singapore Armed Forces and working as a Technician at IBM Manufacturing Solutions. Nicol holds a Bachelor's degree in Mechanical Engineering from the National University of Singapore, a Mechanical Design Engineering certificate from Aarhus University, and a Diploma in Mechatronics Engineering from Temasek Polytechnic.
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