士堯 簡 is a semiconductor professional currently working as a Product Engineer at TSMC. They have expertise in process integration, product engineering, and FinFet technology, with a focus on yield analysis and device target analysis in high-volume manufacturing. They completed a Master's degree in Materials Science and Engineering from National Tsing Hua University, following a Bachelor's degree in a Double Specialty Program of Management and Technology from the same institution. Prior to their current role, they interned as a Process Integration Engineer at TSMC and fulfilled their Mandatory Military Service with the Republic of China Navy in 2021.
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