郭永宇

永宇 郭 is a 3DIC Tech Integration Project Manager currently working at 南亞科技, focusing on wafer-on-wafer bonding processes. Previously, they served as a Principal Engineer at 台灣積體電路製造股份有限公司, where they specialized in advanced chip packaging and process optimization. With extensive experience in etch processes and technology transfer, they have successfully led initiatives that improved production capacity and yield for various semiconductor technologies. 永宇 郭 holds a Master's degree in Chemistry from 國立臺灣大學.