Pu Wang is a Technical Manager at TSMC, where they focus on advanced packaging technologies such as 3DIC, 2.5DIC, and fan-out structures. Previously, they worked as a Process Engineer at Subtron from 2008 to 2011, specializing in substrate processes and coreless developments. Pu holds a Bachelor's degree and a Master's degree in Chemical Engineering from National Taiwan University, completing their undergraduate studies in 2006 and their master's degree in 2008.
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