Ray Li is a Senior R&D Engineer at TSMC's 3DIC R&D center, specializing in advanced packaging processes such as oS process and underfill. With over four years of experience in semiconductor back-end and advanced packaging, including significant roles at Texas Instruments, Ray has demonstrated strong project management and problem-solving skills. Ray holds both a Bachelor's and Master's degree in Chemical Engineering from National Taiwan University. Proficient in Chinese, English, and Japanese, Ray has also contributed to multiple publications and led innovative projects in automation and manufacturing efficiency.
This person is not in the org chart
This person is not in any teams
This person is not in any offices