Richard Wei is an accomplished engineering professional with extensive experience in program management and customer engineering. Currently serving as a Customer Engineering Program Manager in Key Account Management at TSMC since February 2011, Richard has previously held significant roles at Intel Corporation, including Program Manager for Foundry and OSAT Management and Technology Development, where responsibilities included managing foundry product engineering and operations, as well as leading initiatives for inline defect and yield improvement. Richard's early career includes a position as Sr. Principal Engineer at TDK, focusing on MEMS and thin film head etch process development. Richard holds a Ph.D. in Material Science & Engineering from the University of Maryland and a bachelor's degree in the same field from National Tsing Hua University.
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