Sam Wei is a versatile professional with extensive expertise in materials, structural analysis, and FEA simulation, currently serving as a Principal Engineer at TSMC. With over 10 years of experience in numerical analysis and mechanical property evaluation, Sam has previously held senior roles at various organizations, including a Senior Simulation Engineer at General Interface Solution and a Senior Software Engineer at Moldex3D. Sam's academic background includes a PhD candidacy in Civil Engineering and Engineering Mechanics from National Cheng Kung University, along with a Master's Degree and Bachelor's Degree in the same field. Sam's contributions span numerous projects in consumer electronics, enhancing product designs and addressing complex engineering challenges.
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