Tim Peng is a seasoned engineering professional with extensive experience in advanced packaging technology within the semiconductor industry. At PTI 力成科技 from September 2015 to July 2024, Tim held the position of Senior Research and Development Engineer, focusing on TSV CMOS and 3DIC HBM advanced packaging processes, including various techniques such as grinding, CMP, and thermo-compression bonding. From July 2024 to January 2025, Tim worked as a Senior Engineer at 日月光半導體, leading projects related to power module tools and flip chip die bonding. Currently, Tim serves as a Senior Engineer at 台積電 since January 2025, overseeing a team that develops advanced packaging technologies for CoWoS products, and is responsible for assessing new tools and materials for production. Tim holds a Master’s degree in Chemistry from 中原大學, obtained between 2013 and 2015.
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