Tun Sheng Tan is a Principal Engineer at TSMC, specializing in machine learning applications for semiconductor lithography. They develop next-generation resolution enhancement techniques, focusing on optical proximity correction and inverse lithography technology. Previously, they served as a Postdoctoral Associate at the University of Florida and contributed significantly to the FEFF10 x-ray absorption spectroscopy simulation package while working as a Graduate Research Assistant at the University of Washington. Tun Sheng Tan holds a PhD and an MS in Physics from the University of Washington.
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