Wenrui Wang

Wenrui Wang is a Technical Manager at TSMC, specializing in advanced packaging integration. Previously, they served as the Silicon Photonics R&D Process Integration Team Lead at Intel Corporation from 2019 to 2021, where they led process development and defect reduction efforts while mentoring junior team members. Wenrui also contributed to the development of 3DXPoint (Optane) solid-state memory as a Memory R&D Process Integration Engineer at Intel. They hold a Master of Science in Analytics from the Georgia Institute of Technology and a PhD in Condensed Matter and Materials Physics from the University of Illinois at Urbana-Champaign. Additional academic qualifications include two Master's degrees in Condensed Matter and Optical Physics from the University of Delaware and a Bachelor's degree in Physics from Nanjing University.