William Lai has a diverse educational background, holding two bachelor's degrees in Economics and Power Mechanical Engineering, as well as a master's degree in Power Mechanical Engineering, all from National Tsing Hua University. Professional experience includes a position as a Quality and Reliability Senior Engineer, followed by a role as a Quality and Reliability Engineer at 台灣積體電路製造股份有限公司 in July 2022. Prior to this, William served as a Firmware Design Engineer at 華碩 from February 2020 to May 2020.
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