Yi-Ching Kuo is a Principal Engineer at 台灣積體電路製造股份有限公司, specializing in 3D-IC design flow development since 2022. They previously worked as a Research and Development Engineer at 工業技術研究院 from 2016 to 2020, focusing on chip design and software/hardware system integration. Yi-Ching earned both a Master's and PhD from National Taiwan University between 2010 and 2016.
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