YiChen K. has a strong background in engineering, with a Bachelor’s degree in Mechanical, Materials and Aerospace Engineering from INSA Lyon and a Master’s degree in Mechanical Engineering from Tsinghua University. Experience includes internships as a Quality Engineer at Safran and Ornapaper Bhd, and as a Mechanical Engineer Intern at LH PLUS SDN BHD. YiChen K. served as a Research Assistant at Tsinghua University's Laboratory of Intelligent Manufacturing and Precision Machining before taking on a role as a Process Engineer at TSMC, specializing in N22/N28 Chemical-Mechanical Polishing processes. Additionally, a Senior Process Engineer position was held while supporting TSMC subsidiary JASM for two years. An exchange program was completed at the University of Strathclyde in 2018, along with A-Levels in Mathematics, Physics, and Chemistry at INTI International University & Colleges.
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