Yujen (Daniel) Lien is an Advanced Packaging R&D Integration Engineer at TSMC, where they lead technology integration for ultra-high power density applications. With previous roles including Senior R&D Integration Engineer at TSMC and Military Liaison Officer to the American Institute in Taiwan, Yujen has excelled in driving innovative solutions in silicon-to-system co-design. They hold a Bachelor of Science from the United States Military Academy at West Point and a Master of Engineering from National Taiwan University, and have earned accolades as an honor graduate and international award winner.
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