Raj Kumar

Raj Kumar is currently the Vice President of Interconnect Solutions Engineering in the Aerospace & Defense sector at TTM Technologies. With an extensive background in technology and process engineering, Raj has previously held leadership positions at TTM Technologies and Viasystems, overseeing significant advancements in PCB and substrate technologies. Raj's earlier experience includes roles at Allied Signal/Honeywell and Litronic Industries, where they played a critical role in pioneering processes for high-tech manufacturing. They earned a Bachelor of Science in Chemistry from Bhopal University and a Bachelor of Science in Mechanical Engineering from California State University, Fullerton.