Chee Xi Ying is a proactive and analytical Technology Transfer and Development Engineer with a background in semiconductor process integration. They have worked as a Failure Analysis Engineer at Wistron, where they repaired PCBA failures and utilized circuit diagrams for root cause analysis. Currently, they serve as a Senior Process Integration Engineer at United Microelectronics Corporation, leading product tape-out processes and utilizing Statistical Process Control methodologies to enhance manufacturing efficiency. Chee Xi Ying holds a degree in Chemical Engineering from Zhejiang University, complementing their technical expertise.
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