孙敦敏

敦敏 孙 is a Principal Engineer at United Microelectronics Corporation (UMC), where they focus on platform development and transfer, achieving successful product engagement and verification. Previously, they held positions as a PIE at GLOBALFOUNDRIES and Systems on Silicon Manufacturing Company Pte Ltd (SSMC) from 2010 to 2018. They began their career as a PE module at 华润上华半导体 and worked as a PIE at 中芯国际. 敦敏 earned a Bachelor's degree in Electronic Science and Technology from 辽宁大学 in 2005.