銘永游 earned a Master's degree in Microelectronics from National Cheng Kung University from 2012 to 2015. They have experience working as an Equipment Engineer at Micron Technology from 2016 to 2017, focusing on maintenance and troubleshooting of ion implantation and rapid thermal annealing equipment. Currently, as a Process Integration Engineer at United Microelectronics Corporation, they are responsible for managing new product tape outs, maintaining stability in production lines, and utilizing various analytical techniques to improve yield and address customer concerns.
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