洪順閔

R&D process integration engineer

順閔 洪 is an R&D Process Integration Engineer at UMC, specializing in RF GaN HEMT process development since 2022. They completed a master's degree in Photonics at National Chiao Tung University and a bachelor's degree in Electrical Engineering at Yuan Ze University. Previously, they worked as a process engineer at TSMC from 2020 to 2021, focusing on PVD AlCu and TiN metal film processes. With a keen interest in semiconductor physics and process optimization, 順閔 is committed to advancing their expertise and contributing value to their organization.

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