Ryan Chien is a Senior Semiconductor Process Integration Engineer at United Microelectronics Corporation (UMC) since December 2018, bringing expertise in semiconductor process engineering. Prior to this role, Ryan served as a Semiconductor Process Engineer at 力晶科技股份有限公司 from August 2016 to December 2018. Ryan holds a Bachelor of Science degree in Materials Science and Engineering from the National Taiwan University of Science and Technology, which was completed in 2015.
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