Wilson Lee

Wilson Lee is a highly experienced engineer with a strong background in failure analysis and yield enhancement. Currently serving as a Staff Engineer at Qualcomm since January 2013, Wilson handles RMA, NPD, and Qual Failure analysis requests. Prior experience includes serving as a Failure Analysis Section Manager at United Microelectronics Corporation (UMC) since August 2004, leading a team of 12 engineers and technicians, overseeing electrical and physical failure analysis, and developing training programs to enhance skills. Additional responsibilities encompass cost optimization, equipment maintenance, and new product development support. Earlier experience as a Yield Enhancement Engineer at Chartered Semiconductor involved improving product yield, monitoring process controls, and addressing customer inquiries. Wilson holds a 2nd Class Upper degree in Microelectronics from Nanyang Technological University Singapore and a Diploma in Electronic, Electrical and Computing Engineering from Singapore Polytechnic.