Universal Instruments Corporation
Alan Derevensky is a Systems Engineer I at Universal Instruments Corporation, responsible for supporting the commissioning and qualification of backend semiconductor manufacturing systems, as well as developing test fixtures and characterizing measurement instruments. Previously, Alan served as a Mechanical Engineer I and an Electronics Assembly | Reliability Engineering Intern at the same company, focusing on electronics packaging assembly techniques and creating a Python image processing algorithm for projects within the Advanced Process Lab. Earlier experience includes an Engineering Intern role at the Broome County Department of Public Works, collaborating on restoration projects, and a Pre-Calculus Tutor position at Brooklyn College, where tutoring was provided to a diverse group of students. Alan holds a Master of Science and a Bachelor of Science in Mechanical Engineering from Binghamton University and completed high school at The Beacon School.
Universal Instruments Corporation
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We are a technology leader in the design and manufacture of precision automation solutions for the semiconductor and electronics manufacturing industry. With a lineage of more than 100 years, we are the longest-standing electronics assembly company. Our technology solutions are truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more. We employ a highly technical workforce of ~ 500 employees. This expertise and passion to develop innovative solutions to solve our customer’s problems drive our 500+ strong patent portfolio. With 27,000+ systems delivered to date, we offer the broadest range of world-class equipment and services. We also enjoy strategic partnerships with today’s industry leaders, which enables us to stay on the leading edge of technology trends and to deliver the best solutions for the production of a wide variety of the most complex electronic circuits in the World. We offer solutions for a wide range of high-precision assembly needs, including Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Our cutting-edge smart manufacturing software provides real-time data to help manufacturers improve their overall operations. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecycle- from prototyping, process development, and analytical services to advanced technology assembly.