Universal Instruments Corporation
Arash Behzadi serves as the Services Product Manager at Universal Instruments Corporation since August 2023. Previously, Arash held roles at Binghamton University as a Business Analytics Graduate Assistant and Graduate Assistant in the School of Management, where responsibilities included data analysis and providing insights on key performance indicators. Prior experience encompasses a Marketing & Strategy Intern position at Arkanum Adventures, where market research and corporate strategy enhancements were key focus areas, and founding Picshow, which achieved significant product sales growth through innovative marketing strategies. Early career experiences include a trainee role at Lyan Sanat Puya and a Sales Representative position at Baadraan Universal Trading. Arash holds a Master's in Data Analytics and an MBA from Binghamton University, alongside a BS in Electrical and Electronics Engineering from Shahid Bahonar University of Kerman.
Universal Instruments Corporation
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We are a technology leader in the design and manufacture of precision automation solutions for the semiconductor and electronics manufacturing industry. With a lineage of more than 100 years, we are the longest-standing electronics assembly company. Our technology solutions are truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more. We employ a highly technical workforce of ~ 500 employees. This expertise and passion to develop innovative solutions to solve our customer’s problems drive our 500+ strong patent portfolio. With 27,000+ systems delivered to date, we offer the broadest range of world-class equipment and services. We also enjoy strategic partnerships with today’s industry leaders, which enables us to stay on the leading edge of technology trends and to deliver the best solutions for the production of a wide variety of the most complex electronic circuits in the World. We offer solutions for a wide range of high-precision assembly needs, including Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Our cutting-edge smart manufacturing software provides real-time data to help manufacturers improve their overall operations. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecycle- from prototyping, process development, and analytical services to advanced technology assembly.