Universal Instruments Corporation
Bill Stratford is an experienced professional in the fields of customer service and technical management, currently serving as Customer Service Manager for America and Canada at Universal Instruments Corporation since July 2024. Prior to this role, Bill was Field Service Manager for the Americas at De Nora, where a focus on sustainable technologies for water treatment was paramount. Bill's extensive career includes leadership positions such as Director of Aftermarket Sales and Service at JLS Automation, Technical Services Manager at both Ilapak Packaging Machinery and EAM-Mosca Corporation, and Vice President/COO at Keystone Automation Inc. Bill has also contributed as General Manager at Amarillo Wind Machine Co. and as Service Manager at Grundfos Pumps Corp. Bill holds a Bachelor of Science degree in Operations Management from the University of Scranton.
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Universal Instruments Corporation
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We are a technology leader in the design and manufacture of precision automation solutions for the semiconductor and electronics manufacturing industry. With a lineage of more than 100 years, we are the longest-standing electronics assembly company. Our technology solutions are truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more. We employ a highly technical workforce of ~ 500 employees. This expertise and passion to develop innovative solutions to solve our customer’s problems drive our 500+ strong patent portfolio. With 27,000+ systems delivered to date, we offer the broadest range of world-class equipment and services. We also enjoy strategic partnerships with today’s industry leaders, which enables us to stay on the leading edge of technology trends and to deliver the best solutions for the production of a wide variety of the most complex electronic circuits in the World. We offer solutions for a wide range of high-precision assembly needs, including Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Our cutting-edge smart manufacturing software provides real-time data to help manufacturers improve their overall operations. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecycle- from prototyping, process development, and analytical services to advanced technology assembly.