Ryan Kump is a Software Engineer at Veeva Systems since June 2023, with prior experience at JPMorgan Chase & Co. from June 2021 to November 2022 as a Part-Time Software Engineer Intern and Software Engineer Intern. At JPMorgan Chase & Co., Ryan developed a web portal for a vulnerability information API and created a CI/CD pipeline using Jenkins, among other accomplishments. Additionally, Ryan has experience as an Operations Co-op at Fifth Third Bank, managing commercial accounts. Ryan holds a Bachelor of Science in Computer Science from The Ohio State University, earned in 2023, and a high school diploma from St. Xavier High School, completed in 2019.
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