Chee Lee

Chee Lee has extensive work experience in the packaging industry. Chee is currently working as a Senior Principal Packaging Engineer at Veritiv Corporation since May 2023. Prior to this, they worked as a Senior Lead Packaging Designer at Fudy Solutions Inc. from December 2022 to May 2023. Chee Lee also has a long history with Footprint Tech, where they held various roles such as Senior Packaging Engineer, Senior Design Engineer, and Principal Part Packaging & Tooling Engineer from August 2017 to February 2023.

Before joining Footprint Tech, Chee Lee worked at Veritiv as a Packaging Design Lead from October 2011 to July 2017. Chee also worked as a Packaging Design Lead at Unisource Global Solutions from October 2009 to October 2011.

Chee Lee's earlier experience includes working as a Project Engineer at Anchor Packaging from April 2007 to October 2009, as a Tool Design Engineer at Tegrant Corporation from January 2000 to April 2007, and as a Cross Functional Thermoforming Tooling Checker and Tooling Design Engineer at SCA North America from January 1999 to January 2007. Chee began their career as a Semiconductor Mold Tooling Technician at Carsem (M) from January 1996 to January 1997.

Chee Lee's education history includes a Master of Science degree in Industrial Management from Northern Illinois University, which was obtained from 2000 to 2002. Prior to that, from 1998 to 2000, Chee Lee earned a Bachelor of Science degree with a focus on Manufacturing Engineering Technology from the same institution.