VIA NEXT Technologies is a leading system level IC design service company built on over 30 years of silicon design experience from the VIA Group. A complex system-on-chip expert, helping customer on cost saving and time to market, providing flexible services based on customer needs.

Established in 2021, we bring the depth of a seasoned design organization — one that has already delivered CPUs, SoCs, chiplets based advanced-packaged silicon in production. With 200+ tape-outs and productions across nodes ranging from 5nm to 40nm, and offices across Taipei, Hsinchu, Beijing, Shanghai, Singapore, and Fremont, we offer global reach with the responsiveness of a focused partner.

We serve customers in HPC & data center, AI accelerator, communications, and storage markets, a strong design partner of the full design path from architecture and RTL, through DFT, place-and-route, sign-off, advanced packaging, and production coordination with wafer foundries and OSAT partners.

VIA NEXT Technologies Inc

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VIA NEXT Technologies Inc

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