Hardik R. is a mechanical engineer with extensive experience in product development and validation, specializing in packaging for electrical and electronic components in the automotive industry. Currently serving as the Lead Engineer for EE Components Packaging at VINFAST, Hardik focuses on optimizing component positioning and compliance with vehicle homologation requirements. Previously, Hardik held roles as a Senior Engineer at Magna Steyr Pune and Product Engineer at Aptiv, where they demonstrated expertise in automotive component design and thorough understanding of systems engineering processes. Hardik's background also includes mold design and development, supported by a diploma in Tool & Die Making from the Indo German Tool Room.
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