Ryan Legaspi serves as the Test Engineering Manager at Vishay Intertechnology, Inc. since November 2023, bringing extensive experience from previous roles at ON Semiconductor and Microchip Technology. During a tenure of over 18 years at ON Semiconductor, Ryan advanced through various positions, demonstrating expertise in new product development test engineering, including responsibilities for mentoring junior engineers and managing test migration projects. Ryan's technical skills encompass the development of multi-site ATE solutions for wafer sort and final test processes, as well as extensive work with various semiconductor technologies such as controllers and converters. Ryan holds a Bachelor of Science in Electrical, Electronics, and Communications Engineering from the Technological University of the Philippines.
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