婷惟 張 is a highly skilled Failure Analysis Engineer with over 8 years of experience in semiconductor metrology and failure analysis. Currently employed at Winbond as a Senior Failure Analysis Engineer, they specialize in defect localization and root cause analysis using advanced techniques such as FIB and TEM. Throughout their career, they have collaborated across departments to enhance yield improvement and have developed standardized procedures to streamline team efficiency.婷惟張 has a Master's degree from National Taiwan University of Science and Technology and a Bachelor's degree in Materials Engineering from Tatung University.
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