Erwin Cohen

Erwin Cohen is a Lead RF Packaging Development Engineer at Wolfspeed, A Cree Company, since October 2016, focusing on package development for GaN on SiC RF products and driving the RF package development roadmap. Previous experience includes serving as Principal Member of Technical Staff in Packaging Development at GLOBALFOUNDRIES, where Erwin led the development of 2.5D semiconductor packaging technology, and a significant tenure at IBM from July 1998 to June 2015, holding roles such as Technical Lead & Program Manager in Advanced Package Development and Senior Engineer in various capacities. Early career experience includes positions at General Motors, where Erwin worked as a Production Supervisor and Process Engineer. Erwin holds a PhD in Solid State Electrical Engineering from Purdue University and a Bachelor of Science in Mechanical Engineering from the University of Illinois Urbana-Champaign.