Ryan C. has over 15 years of experience as a Process, Equipment, and Development Engineer, specializing in Aluminum Wirebond Process and SMT Process Development. They have held various roles, including Principal Engineer at onsemi and Senior Staff Engineer at Infineon Technologies. Ryan's extensive experience encompasses positions as a Lead Process Engineer at Integrated Microelectronics Inc. and as a Maintenance Technician and Process Engineer at TEAM PACIFIC CORPORATION. Currently, Ryan serves as an SME in Package Development and Process Development at Wolfspeed. They earned a Bachelor of Science in Electrical Engineering from the Technological University of the Philippines.
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