Vikrant Singh

Process Engineer- Wafer Thinning/electroless Plating

Vikrant Singh is a highly skilled Process Engineer currently employed at Wolfspeed, specializing in wafer thinning and electroless plating since February 2023. Previously, Vikrant worked as a Process Development Engineer at Seagate Technology, where significant contributions included enhancing Dice-on-Tape technology and implementing a new metrology inspection method, among other achievements. Earlier experiences include roles as a Mechanical Engineering Intern at Maybell Quantum Industries, a Student Researcher at the University of Colorado Boulder, and various research and engineering positions across multiple institutions, demonstrating expertise in thermal calculations, sensor development, and mechanical design. Vikrant holds a Master's degree in Mechanical Engineering from the University of Colorado Boulder and a Bachelor's degree from Delhi Technological University.

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