钱佳春

佳春 钱 is a Senior Hardware Engineer at 小米科技 since 2021, focusing on advanced hardware development. Previously, they served as a Senior BiW Engineer and a BIW Design Engineer at 吉利控股集团, where they contributed to innovative vehicle body architectures. Their earlier roles include working as a BIW DRE at 上海汽车集团股份有限公司 and an internship at 广汽丰田汽车有限公司. 佳春 earned a Bachelor’s degree in Vehicle Engineering from 西安交通大学 and is currently pursuing a Master’s degree in Engineering/Industrial Management at 上海交通大学.