Sri Charan Vemula

Sri Charan Vemula began their work experience as a Research Assistant at the University of Houston in 2003. Sri Charan then moved on to working as a Research Assistant at IMEC from 2006 to 2007. In 2007, they returned to the University of Houston as a Doctoral student until 2011. After completing their education, Sri Charan Vemula joined GLOBALFOUNDRIES in 2011 as a Sr Process Engineer, where they developed advanced front end of line (FEOL) etch and plasma ashing processes for 20nm common platform CMOS Logic technology. Sri Charan then became a Principal Engineer at GLOBALFOUNDRIES from 2015 to 2017. In 2017, they transitioned to the role of Member of Technical Staff at GLOBALFOUNDRIES, where they served as the team lead for 7nm and 14nm FEOL RIE processes. In 2019, they joined Intel Corporation as a Process Development Engineer, focusing on dry etch process development for Intel's 3D XPoint. Sri Charan also served as an Engineering Manager at Intel Corporation from 2021 to 2023. Currently, Sri Charan Vemula holds the position of Engineering Manager at 3D Glass Solutions, Inc. since 2023.

Sri Charan Vemula obtained a Bachelor's degree in Electrical Engineering from Andhra University, where they studied from 1998 to 2002. Sri Charan then pursued a Master's degree in Electrical and Computer Engineering at the University of Houston from 2003 to 2006. Following this, Sri Charan Vemula went on to complete a PhD in Electrical and Computer Engineering at the University of Houston, where they were enrolled from 2007 to 2010.