Roger Yeh

Roger Yeh is a seasoned engineering professional with extensive experience in thermal and mechanical design within the technology sector. Currently serving as Senior Manager of the Engineering Service Division 2 at 智邦科技 since December 2018, Roger oversees thermal design teams for various products, including 19"/21" switches, COMe, Smart NIC, OAM AI servers, and WiFi solutions, focusing on areas such as immersion cooling development. Previously, Roger held leadership roles focused on thermal solutions at Compal and Foxconn, contributing to the development and verification of server product thermal solutions for major clients, including HP, Intel, and Dell. Educational qualifications include a Master’s degree in Aeronautics/Aviation/Aerospace Science and Technology from National Cheng Kung University and a Bachelor's degree in Aerospace Engineering from Feng Chia University.