Ryan Rieck

Ryan Rieck has extensive work experience in the engineering field. Ryan currently holds the position of Front End Engineering Manager at Advanced Circuits since April 2022. Prior to that, they worked at FlipChip International as a Design Engineer for a duration of 16 years, from January 2006 to July 2022. Before joining FlipChip International, Ryan worked at Laminate Technologies Inc. as a Design/Product Engineer from May 1998 to September 2005. Their earlier experience includes working as a Design Engineer at Dynaco Corp from June 1987 to May 1998.

Ryan Rieck obtained an Associate's degree in Computer Aided Design from ITT Technical jobs in the academic years from 1986 to 1987.