Daniel Steadman is a skilled SoC Emulation Engineer with over eight years of experience leading diverse technology and manufacturing projects. Currently serving as the Client SoC Emulation Lead at AMD since 2022, Daniel previously held positions at Intel Corporation and Hewlett-Packard, including roles in product development and project leadership. They possess deep expertise in data analysis, organizational strategy, and supply chain integration, successfully combining business and technical skills to create innovative solutions. Daniel is pursuing a Bachelor of Science in Electrical and Electronics Engineering from Oregon State University and a Master’s Degree in Electrical Engineering from Colorado State University.
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