YiWei Liu is an experienced Research and Development Engineer specializing in the semiconductors industry, with a focus on advanced packaging development including 2.5D and Fan-out technologies. Currently serving as a Staff Engineer at AMD and in Supplier Management at Xilinx, YiWei previously held roles as a Sr. Integration Engineer at SPIL and an R&D Integration Engineer at TSMC. YiWei holds a Master of Chemical Engineering from National Tsing Hua University, emphasizing expertise in the polymer field and skills in project integration, problem-solving, and process engineering.
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