AEGIS PCB traces its material manufacturing heritage back to 1982, with more than 40 years of experience in PCB base material R&D and production.

We support advanced electronics projects with high-frequency PCB laminates, RF and microwave materials, thermal-management substrates, bonding sheets, specialty composite materials, and advanced PCB manufacturing support.

Our laminate production base includes 280+ employees, 10+ dipping machines, 40+ presses, and 3 microwave composite dielectric substrate production lines. Annual laminate capacity includes approximately 1.9 million m² of PTFE-based laminates, 50,000 m² of AG-CM series materials, and 1.5 million m² of AG-RF-S08 series materials.

In addition to laminate materials, AEGIS supports PCB manufacturing through a multi-site production network in China, representing an estimated 120,000+ m² of production area, 1,200+ production, engineering, quality, and support staff, and 1.8 million+ m² annual PCB capacity.

Our portfolio covers PTFE-based RF laminates, ceramic-filled laminates, hydrocarbon-ceramic RF materials, metal-backed thermal substrates, bonding sheets, prepregs, copper foil options, composite dielectric materials, RF & microwave PCB, high-frequency PCB, multilayer PCB, HDI PCB, rigid-flex PCB, heavy copper PCB, and thermal-management PCB.

AEGIS helps engineering and sourcing teams review material selection, Dk/Df requirements, copper profile, dielectric thickness, stackup planning, material substitution, and production feasibility.

Contact us at quote@aegispcb.com for datasheets, material selection, cross-reference review, or PCB quotation support.


AEGIS PCB

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AEGIS PCB

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