Annette Teng

Annette Teng is a highly experienced individual in the field of electronic packaging, with a background in materials engineering and chemistry. Currently serving as the Director of Package Integration at AIM Photonics and as the Chief Technology Officer at Promex Industries Inc. Annette has also held key roles at Silanna Semiconductor, CORWIL, and Linear Technology. Additionally, Annette has contributed as the Chairperson of IEEE-Electronics Packaging Society SCV Chapter and as the Electronic Packaging Lab Manager at Hong Kong University of Science and Technology.